Dear colleagues,
The Special Issue on Smart Manufacturing and Industry 4.0 is a curated collection of articles focusing on the integration of advanced technologies, automation, and data-driven processes in modern manufacturing environments. This special issue explores topics such as cyber-physical systems, artificial intelligence, Internet of Things (IoT), big data analytics, and cloud computing in the context of reshaping traditional industries towards more efficient, flexible, and interconnected production systems. Researchers and experts contribute their insights and research findings to illuminate the opportunities, challenges, and future prospects of smart manufacturing and the Fourth Industrial Revolution. The special issue aims to advance knowledge in the field of Industry 4.0 and inspire innovation in manufacturing practices. This special issue of Journal of Engineering Advances including but not limited to the following topics:
Cyber-Physical Systems in Manufacturing
Internet of Things (IoT) Applications in Industry 4.0
Big Data Analytics for Smart Manufacturing
Cloud Computing in Industrial Automation
Artificial Intelligence and Machine Learning in Manufacturing
Robotics and Automation Technologies
Digital Twin Technology for Smart Factories
Additive Manufacturing and 3D Printing
Augmented Reality and Virtual Reality in Production
Blockchain for Supply Chain Management
Sustainable Manufacturing Practices
Cybersecurity in Industry 4
Manuscript Submission Information
Authors should submit their manuscripts for the special issue by emailing them as an attachment to specialissue@hillpublish.com or by using the online submission system. The manuscript should be submitted by one of the authors, and submissions by anyone other than the authors will not be accepted. Additionally, the submitted manuscript should include a cover letter that specifies the special issue to which the manuscript is being submitted.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). The submitted papers should be properly formatted and written in fluent English. All manuscripts are thoroughly refereed through a double-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Guidelines page.