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The Educational Review, USA

ISSN Online: 2575-7946 Downloads: 671999 Total View: 6253586
Frequency: monthly ISSN Print: 2575-7938 CODEN: TERUBB
Email: edu@hillpublisher.com

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Special Issue

Higher Education: Shaping the Future

Dear Colleagues,

Higher education stands at a critical juncture as it faces unprecedented challenges and opportunities in preparing future generations for an increasingly complex and interconnected world. The rapid evolution of technology, shifting workforce demands, and global societal changes require institutions to reimagine their roles, curricula, and pedagogical approaches. The future of higher education must embrace innovation while maintaining academic rigor, accessibility, and relevance in a rapidly changing landscape.

In this special issue of The Educational Review, USA, we aim to explore the transformative potential of higher education in shaping the future. We welcome original research articles, case studies, and critical perspectives that examine emerging trends, challenges, and innovative practices in higher education.

We invite researchers and practitioners to submit original research articles, reviews, and perspectives related to higher education. We are particularly interested in papers that address the following topics:

• Innovative pedagogies and future-ready curricula
• Digital transformation in higher education
• Interdisciplinary approaches to global challenges
• Equity, diversity, and inclusion in academia
• Sustainable campus practices and climate action
• Industry-academia collaboration for workforce development
• Internationalization and cross-border education
• Policy reforms for higher education transformation

Guest Editors

Manuscript Submission Information

Authors should submit their manuscripts for the special issue by emailing them as an attachment to specialissue@hillpublish.com or by using the online submission system. The manuscript should be submitted by one of the authors, and submissions by anyone other than the authors will not be accepted. Additionally, the submitted manuscript should include a cover letter that specifies the special issue to which the manuscript is being submitted.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). The submitted papers should be properly formatted and written in fluent English. All manuscripts are thoroughly refereed through a double-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Guidelines page.

Deadline for manuscript submissions

December 31, 2025

List of Publications in This Special Issue